Our current offering
Multiple ways to use LS-DYNA in the cloud
Hardware, Software and Services
Latest High Performance Computing architecture with optimized system software allows an easy and effective usage of LS-DYNA
For efficient use of LS-DYNA on High Performance Computing platforms we work with selected Platform Service Providers, who have ample experience in operation and maintenance of dedicated infrastructure for LS-DYNA. Hardware resources are being provided in collaboration with the cloud-based infrastructure providers CPU24/7, Gompute and Rescale.
LS-DYNA is installed and configured for effective calculations on the High Performance Computing platform available on LS-DYNAcloud. System maintenance and user support are provided by DYNAmore. A telephone hotline for user related questions is provided by local LS-DYNA Support Distributors.
Software tools like d3view, Plotcompress and FEMZIP/L for effective data compression can be provided. Dummy and barrier models are available. LS-TASC and LS-OPT can be used for the effective solution of optimization problems.
Frequently Asked Questions
Questions related to the LS-DYNAcloud platform
The performance of LS-DYNA is optimized for actual parallel computer architectures. With the High Performance Computing platform available on LS-DYNAcloud satisfying speedups can be achieved up to parallel usage of 1000s of cores. The speedup varies depending on the type of application and the geometry of the model. In many cases (e.g. small models) speedup […]
ANSYS/LS-DYNA is a LS-DYNA module, which is integrated into the ANSYS modeling and solution environment. MSC Nastran solution700 is a similar integration for LS-DYNA into the Nastran solution phases. Both ANSYS/LS-DYNA users and MSC Nastran solution700 users are welcome to use LS-DYNAcloud services. Both Nastran and ANSYS input data can be imported into LS-DYNA.
Yes, LS-DYNAcloud services are provided through local LS-DYNA distributors.
System support and LS-DYNA installation support is provided by DYNAmore. User support via telephone is being provided by your local LS-DYNA support distributor. Backup support is being given by DYNAmore. FAQs and e-mail support is being given through DYNAsupport
There is a good collection of actual papers available on DYNAlook
LS-DYNA User Manuals, FAQs, tips and tricks, and news about updates are available on DYNAsupport.
LS-DYNA is a general-purpose finite element program capable of simulating complex real world problems. It is the most widely used crash code in the automotive industry. It provides implicit and explicit time-stepping schemes and multiple spacial discretizations.
Examples for the usage of LS-DYNA on Cloud Platforms provided by our Hardware Partners
The Gompute HPC service enabled Formtech to provide a state of art service to its customers. In particular, dynamic simulations of composite parts and vehicles in crash events have been conducted taking advantage of the Gompute computing power to solve models with large meshes and small time steps. Using Gompute’s HPC cluster has reduced the development time by more than half and increased the efficiency, which allowed Formtech to deliver on the most challenging time scales. Gompute has been very responsive at all times to changing needs of hardware and its technical team showed a great dedication to support.
The use of Gompute HPC Cloud allowed us to satisfy our customer expectations in case of a full scale multiple unit train crash simulation according to EN-15227 standard. We would not be able to provide sufficient computing power with our own resources.
The main reason for choosing Gompute was the possibility to use a pre-configured environment with the LS-Dyna solver and availability Infiniband connected modern processors, combined with tools as remote 3D workstations. Furthermore, the access to skilled HPC and CAE engineers that supports the Gompute on-demand service and its users influenced the decision.
Without access to the extra computation capacity it would not have been possible to meet the deadlines and provide the customer with needed simulation results.
Marian H. Ostrowski